ASML and imec Join Forces to Advance EUV Lithography
Collaboration Spurs Exploration of Novel Lithography Techniques
Effort Bolstered by Availability of 0.55 NA EUV System
Research and innovation hub imec and lithographic equipment developer ASML have entered the next stage of their long-standing collaboration with the opening of a new laboratory dedicated to testing the latest High NA EUV lithography system. The dual-stage extreme ultraviolet (EUV) lithography system is the first in a new generation of machines that will enable the production of even smaller and more powerful chips.
The collaboration between imec, ASML, and other partners will enable the exploration of novel lithography techniques and materials that could further improve the performance of EUV lithography. The research will focus on developing new resist materials, optimizing the EUV light source, and improving the imaging performance of the lithography system.
The 0.55 numerical aperture (NA) EUV system used in the new lab is a key enabler for the research. The higher NA allows for smaller features to be printed on the wafer, which is essential for the production of next-generation chips. The system also features a number of other improvements that make it more efficient and reliable.
The opening of the new lab is a significant milestone in the development of EUV lithography. The collaboration between imec and ASML is expected to lead to further breakthroughs in this critical technology, which is essential for the continued advancement of the semiconductor industry.
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